Gravitationally-assisted control of spread of viscous material applied to semiconductor assembly components

ABSTRACT

A method of forming high definition elements for electrical and electronic devices, substrates, and other components from or including viscous material. The method includes inverting the electrical components after the viscous material is applied and maintaining the inverted orientation until the viscous material dries or cures enough to maintain definition of its perimeter and edge characteristics.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a divisional of application Ser. No. 08/709,182,filed Sep. 6, 1996, now U.S. Pat. No. 6,083,768, issued Jul. 4, 2000.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to maintaining the structure of viscousmaterials applied to semiconductor components. More particularly, thepresent invention relates to inverting electrical components formed fromviscous materials or which include viscous materials in order tomaintain the material boundary definition during baking, curing, and/ordrying.

2. State of the Art

Higher performance, lower cost, increased miniaturization of components,and greater packaging density of integrated circuits are goals of thecomputer industry. As components become smaller and smaller, tolerancesfor all semiconductor structures (circuitry traces, printed circuitboard and flip chip bumps, adhesive structures for lead attachment,encapsulation structures, and the like) become more and more stringent.However, because of the characteristics of the materials (generallyviscous materials) used in forming the semiconductor structures, it isbecoming difficult to form smaller circuitry traces, conductive polymerbumps with closer pitches, adequate adhesive structures for leadsattachment, and adequate encapsulation structures.

U.S. Pat. No. 5,286,679 issued Feb. 15, 1994 to Farnworth et al. (“the'679 patent”), assigned to the assignee of the present invention andhereby incorporated herein by reference, teaches attaching leads to asemiconductor device with adhesive in a “lead-over-chip” (“LOC”)configuration. The '679 patent teaches applying a patternedthermoplastic or thermoset adhesive layer to a semiconductor wafer. Theadhesive layer is patterned to keep the “streets” on the semiconductorwafer clear of adhesive for saw cutting and to keep the wire bondingpads on the individual dice clear of adhesive for wire bonding.Patterning of the adhesive layer is generally accomplished by hot orcold screen/stencil printing or dispensing by roll-on. Following theprinting and baking of the adhesive layer on the semiconductor wafer,the individual dice are singulated from the semiconductor wafer. Duringpackaging, each adhesive coated die is attached to leadfingers of a leadframe by heating the adhesive layer and pressing the leadfingers ontothe adhesive. If the adhesive layer is formed of a thermoset material, aseparate oven cure is required. Furthermore, the adhesive layer may beformulated to function as an additional passivating/insulating layer oralpha barrier for protecting the packaged die.

Although the teaching of the '679 patent is a substantial advancementover previous methods for attaching leads in a LOC configuration, theminiaturization of the circuitry makes it difficult to achieve anadequate profile on the adhesive such that there is sufficient area onthe top of the adhesive to attach the leadfingers. The process disclosedin the '679 patent is illustrated in FIGS. 23-29. FIG. 23 illustrates aside, cross-sectional view of a semiconductor substrate 602 with a bondpad 604, wherein a stencil or a screen print template 606 has beenplaced over the semiconductor substrate 602. The semiconductor substrate602 is generally a wafer, although the term as used herein is not sorestricted, and other substrate structures includingsilicon-on-insulator (“SOI”) and printed circuit boards (“PCB”) arespecifically included. The stencil or screen print template 606 ispatterned to clear the area around the bond pads 604 and to clear streetareas 608 for saw cutting (i.e., for singulating the substrate intoindividual dice). An adhesive material 610 is applied to the stencil orscreen print template 606, as shown in FIG. 24. Ideally, when thestencil or screen print template 606 is removed, adhesive prints 612 areformed with vertical sidewalls 614 and a planar upper surface 616, asshown in FIG. 25. However, since the adhesive material 610 must havesufficiently low viscosity to flow and fill the stencil or screen printtemplate 606, as well as allow for the removal of the stencil or screenprint template 606 without the adhesive material 610 sticking thereto,the adhesive material 610 of the adhesive prints 612 will spread, sag,or flow laterally under the force of gravity after the removal of thestencil or screen print template 606, as shown in FIG. 26. Thispost-application flow of adhesive material 610 can potentially cover allor a portion of the bond pads 604 or interfere with the singulating ofthe semiconductor wafer by flowing into the street areas 608.

Furthermore, and of even greater potential consequence than bond pad orstreet interference is the effect that the lateral flow or spread ofadhesive material 610 has on the adhesive material upper surface 616. Asshown in FIG. 27, the adhesive material upper surface 616 is the contactarea for leadfingers 618 of a lead frame 620. The gravity-induced flowof the adhesive material 610 causes the once relatively well-definededges 622 of the adhesive material to curve, resulting in a loss ofsurface area 624 (ideal shape shown in shadow) for the leadfingers 618to attach. This loss of surface area 624 is particularly problematicalfor the adhesive print material upper surface 616 at the longitudinalends 626 thereof. At the adhesive material longitudinal ends 626, theadhesive material flows in three directions (to both sides as well aslongitudinally), causing a severe curvature 628, as shown in FIGS. 28and 29. Stated are three ways the longitudinal ends of the adhesiveprint on patch flow in a 180° flow front, resulting in blurring of theprint boundaries into a curved perimeter. This curvature 628 results incomplete or near complete loss of effective surface area on the adhesivematerial upper surface 616 for adhering the outermost leadfinger closestto the adhesive material end 626 (leadfinger 630). This results in whatis known as a “dangling lead.” Since the leadfinger 630 is notadequately attached to the adhesive material end 626, the leadfinger 630will move or bounce when a wirebonding apparatus (not shown) attempts toattach a bond wire (not shown) between the leadfinger 630 and itsrespective bond pad 604 (shown from the side in FIG. 29). This movementcan cause inadequate bonding or non-bonding between the bond wire andthe leadfinger 630, resulting in the failure of the component due to adefective electrical connection.

LOC attachment can also be achieved by placing adhesive material on theleadfingers of the lead frame rather than on the semiconductorsubstrate. The adhesive material 702 is generally spray applied on anattachment surface 704 of leadfingers 706, as shown in FIG. 30. However,the viscous nature of the adhesive material 702 results in the adhesivematerial 702 flowing down the sides 708 of the leadfinger 706 andcollecting on the reverse, bond wire surface 710 of the leadfinger 706,as shown in FIG. 31. The adhesive material 702 which collects and cureson the bond wire surface 710 interferes with subsequent wirebondingwhich can result in a failure of the semiconductor component. The flowof adhesive material 702 from the attachment surface 704 to the bondwire surface 710 can be exacerbated if the leadfingers 706 are formed bya stamping process rather than by etching, the other widely employedalternative. The stamping process leaves a slight curvature 712 to edges714 of at least one surface of the leadfinger 706, as shown in FIG. 32.If an edge curvature 712 is proximate the leadfinger attachment surface704, the edge curvature 712 results in less resistance (i.e., lesssurface tension) to the flow of the adhesive material 702. This, ofcourse, results in the potential for a greater amount of adhesivematerial 702 to flow to the bond wire surface 710.

Material flow problems also exist in application of encapsulationmaterials. After a semiconductor device is attached to a printed circuitboard (“PCB”) by any known chip-on-board (“COB”) technique, thesemiconductor device is usually encapsulated with a viscous liquid orgel insulative material (e.g., silicones, polyimides, epoxies, plastic,and the like). This encapsulation (depending on its formulation) allowsthe semiconductor device to better withstand exposure to a wide varietyof environmental conditions such as moisture, ions, heat and abrasion.

One technique used in the industry is illustrated in FIGS. 33-35. Astencil 802 is placed on a conductor-carrying substrate or PCB 804 suchthat an open area or stencil cavity 806 in the stencil 802 exposes asemiconductor device 808 to be encapsulated and a portion of thesubstrate or PCB 804 surrounding the semiconductor device 808, as shownin FIG. 33. An encapsulant material 810 is then extruded from a nozzle812 into the stencil cavity 806, as shown in FIG. 34. However, when thestencil 802 is removed, the encapsulant material 810 sags or flowslaterally under the force of gravity, as shown in FIG. 35. This flowingthins the encapsulant material 810 on the top surface 814 of thesemiconductor device 808, which may result in inadequate protection forthe semiconductor device 808. Using a thicker encapsulant material wouldhelp minimize the amount of flow; however, thicker encapsulant materialsare difficult to extrude through a nozzle and are subject to theformation of voids/air pockets. These voids/air pockets can causedelamination from the PCB 804 or the semiconductor device 808, and ifthe voids/air pockets contain water condensation, during subsequentprocessing steps the encapsulant material can be heated to the point atwhich the condensed water vaporizes, causing what is known as a “popcorneffect” (i.e., a small explosion) which damages (i.e., cracks) theencapsulation material, resulting in at least contamination and usuallyirreparable damage, effectively destroying the semiconductor device.Furthermore, using encapsulant materials with high thixotropic indexesmay result in a concave shape which thins the encapsulant material 810on the top surface 814 of the semiconductor device 808, which may resultin inadequate protection for the semiconductor device 808, as shown inFIG. 36.

In an effort to cope with the encapsulant flow problem, the dammingtechnique shown in FIGS. 37-40 has been used. A high viscosity material902 is extruded through a nozzle 904 directly onto a substrate or PCB906 to form a dam 908 around a semiconductor device 910, as shown inFIG. 37, or a stencil 912 can be placed on the substrate and PCB 906such that a continuous aperture 914 in the stencil 912 exposes an areaaround the semiconductor device 910 to be dammed, as shown in FIG. 38.The high viscosity material 902 is then disposed in the stencil aperture914 to form the dam 908. A low viscosity encapsulation material 916 isthen extruded into the area bounded by the dam 908 by a second nozzle918, as shown in FIG. 39. The dam 908 prevents the low viscosityencapsulation material 916 from flowing, to form the dammed encapsulatedstructure 920 shown in FIG. 40 after curing. The dam 908 can be madewith high viscosity material without adverse consequences since it doesnot directly contact the semiconductor device 910 or form any part,other than a damming function, of the encapsulation of the semiconductordevice 910. Although this damming technique is an effective means ofcontaining the low viscosity encapsulation material 916, it requiresadditional processing steps and additional equipment, which increase thecost of the component.

Material flow problems further exist in forming conductive line andtrace materials. As discussed in Liang et al., “Effect of SurfaceEnergies on Screen Printing Resolution,” IEEE Transactions onComponents, Packaging, and Manufacturing Technology—Part B, Vol. 19, No.2, May 1996 (“the Liang article”), miniaturization of semiconductorpackages results in increased circuit densities which require aproportionate reduction of the width of printed lines and traces onsemiconductor substrates. However, there are two conflictingrequirements for the conductive material applied in screen printing theprinted lines and traces. The first requirement is that the conductivematerial should have sufficiently low viscosity to remove mesh marks andsurface imperfections induced during the printing process. Theconflicting requirement is that the conductive material should besufficiently high in viscosity such that it does not flow excessively(i.e., spread). If the conductive material spreads, parallel lines couldcontact one another, resulting in a short. The Liang articleinvestigates the influences of surface energies of the substrates andthe conductive material on screen printing resolution. The conclusion ofthe Liang article is to use substrates with low surface energies, suchas polymer-based substrates, to decrease the wettability of theconductive material to improve screen printing resolution. However, thisapproach limits the flexibility of using different substrate materialfor applications demanding different performance parameters.Furthermore, using polymer-based substrates may not be acceptable incertain applications such as high surface energy ceramic substrate.

Material flow problems further exist in forming conductive bumps onprinted circuit boards and flip chips. Solder bumps, also termed “C4”bumps, for Controlled Collapse Chip Connection, are a conventional meansfor attaching and forming an electrical communication between a flipchip and a substrate or PCB, wherein the solder bumps are formed on theflip chip as a mirror-image of the connecting bond pads on the PCB, orvise versa. The flip chip is bonded to the PCB by reflowing the solderbumps.

State-of-the-art solder bumps are generally made of multiple layers ofvarious metals or metal alloys (e.g., lead, tin, copper) which willachieve an effective, strong and controlled-boundary bond between thesubstrate/PCB and the flip chip. However, the formation of these layeredsolder bumps requires a substantial number of processing steps whichincrease the cost of the component. Furthermore, the solder bumpsrequire a high temperature to reflow during the attachment of the flipchip to the substrate/PCB, which may damage temperature-sensitivecomponents on the semiconductor device. Thus, solder bumps are beingreplaced by conductive polymer bumps.

As shown in FIG. 43, conductive polymer bumps 1002 are formed on bondpads 1004 on a semiconductor device substrate 1006. Alternatively, thebumps may be applied to a carrier substrate, such as a PCB. The bondpads 1004 are in electrical communication with circuitry (not shown) onor in the semiconductor substrate 1006 via electrical traces 1008 (shownin shadow) in or on the semiconductor substrate 1006. The conductivepolymer bumps 1002 are generally formed either by screen printing orstenciling. As shown in FIG. 41, a print screen or stencil 1010 isplaced over the semiconductor substrate 1006 with openings 1012 over andaligned with each bond pad 1004. A conductive polymer 1007 is depositedin the openings 1012, as shown in FIG. 42. The print screen or stencil1010 is then removed to form the conductive polymer bumps 1002, as shownin FIG. 43. The conductive polymer bumps 1002 are generally made frommaterial which is sufficiently viscous that minimal material flow occurswhen the print screen or stencil 1010 is removed. However, thisself-minimization of flow is only applicable to specific limited ratiosof height to width of the conductive polymer bumps 1002. If the heightof the conductive polymer bump 1002 is too great relative to the width,the weight of the conductive material will cause the conductive polymerbump 1002 to collapse on itself and flow laterally. Thus,height-to-width ratios approaching the preferred target of 3:1 orgreater obtainable with solder bumps are unattainable with presentmethods. In short, to attain a satisfactory height of the conductivepolymer bump 1002, the width of the conductive polymer bump 1002 must beincreased proportionately. However, when the conductive polymer bump1002 width is increased, for a given minimum pitch in spacing betweenadjacent conductive polymer bumps 1002, bond pad pitch also increases,which takes up more space on the semiconductor substrate 1006, limitingthe number and arrangement of the die-to-carrier substrate connections.This is, of course, in conflict with the goal of miniaturizingsemiconductor devices of ever-increasing circuit density.

Thus, it can be appreciated that it would be advantageous to develop atechnique to control viscous material flow in the formation ofsemiconductor components while using commercially-available,widely-practiced semiconductor device fabrication techniques.

SUMMARY OF THE INVENTION

The present invention relates to a method for maintaining viscousmaterial boundary definition by inverting electrical components formedfrom viscous materials or which include viscous materials during dryingor curing.

The present invention comprises using standard techniques for applyingviscous materials (e.g., spin on, spray on, roll on, screen printed, andthe like) which form semiconductor device elements, such as circuitrytraces, printed circuit board and flip chip bumps, adhesive structuresfor lead attachment, encapsulation structures, and the like. Afterapplication of the viscous materials on a semiconductor or carrierstructure, the entire structure is flipped to an inverted position,followed by ambient or elevated temperature drying or curing. Ratherthan gravitational forces causing the viscous material to flow andexpand as when upright and supported from below, the gravitationalforces on the inverted semiconductor or carrier structure maintain theshape and boundary definition of the original viscous materialformation. It has been found that inverting the semiconductor results ina substantial improvement for wall angles reduction in corner radius ofcurvature and improvement in the shape and boundary definition of theelements made from the viscous materials.

As a general matter, the entire structure is inverted immediately or asquickly as practical after the application of the viscous material toprevent any substantial spreading of the viscous material. Thisimmediate inversion maximizes the benefit of the present invention bypreserving the shape and boundary definition of the viscous material asapplied. It is, of course, understood that the viscous material must becapable of adhering to the semiconductor or carrier structure and mustnot be of such a low viscous that it drips when inverted.

Furthermore, with regard to drying or curing, the structure need only beinverted until the viscous material has stabilized sufficiently tomaintain its shape and boundary definition. Depending on the particularviscous material used, the minimum inversion time could be the timerequired to cure the outer surfaces of the viscous material such that afilm is formed which contains the viscous material therein, or theminimum inversion time could be the time required to completely dry orcure the viscous material element.

BRIEF DESCRIPTION OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming that which is regarded as the present invention,the advantages of this invention can be more readily ascertained fromthe following description of the invention when read in conjunction withthe accompanying drawings in which:

FIGS. 1-5 are a top plan and side cross sectional views of adhesiveprints formed by the method of the present invention;

FIGS. 6-8 are schematic and graphical representations of experimentalresults comparing the lateral edges of an adhesive print formed by aprior art method and the method of the present invention;

FIGS. 9-11 are schematic and graphical representations of experimentalresults comparing the trailing edge of an adhesive print formed by aprior art method and the method of the present invention;

FIGS. 12-14 are schematic and graphical representations of experimentalresults comparing the leading edge of an adhesive print formed by aprior art method and the method of the present invention;

FIGS. 15-17 are cross-sectional views of an adhesive coated lead fingerof a LOC semiconductor assembly formed by the inversion method of thepresent invention;

FIG. 18 is a cross-sectional view of an encapsulated semiconductordevice formed by the inversion method of the present invention;

FIGS. 19-21 are oblique views of the formation of traces on asemiconductor substrate by the method of the present invention;

FIG. 22 is a side cross-sectional view of a conductive polymer bumpformed by the method of the present invention;

FIGS. 23-29 are side cross-sectional views of a technique of formingadhesive areas on a substrate for LOC attachment;

FIGS. 30-32 are side cross-sectional views of a technique of formingadhesive areas on leadfingers for LOC attachment;

FIGS. 33-35 are side cross-sectional views of a technique of forming anencapsulant layer on a semiconductor device;

FIG. 36 is a side cross-sectional view of an encapsulated semiconductordevice with a concave shaped cured encapsulant;

FIGS. 37-40 are oblique views of techniques of forming an encapsulantlayer on a semiconductor device using high viscosity material dams; and

FIGS. 41-43 are side cross-sectional views of a technique of formingconductive polymer bumps on a substrate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIGS. 1-5 illustrate forming a rectangular adhesive print 102 on asemiconductor substrate 104. FIG. 1 shows several rectangular adhesiveprints 102 uniformly distributed on the semiconductor substrate 104,such as a silicon wafer or SOI substrate. The spaces between therectangular adhesive prints 102 can have a plurality of bond pads 108disposed between a pair of rectangular adhesive prints 102. The spacesmay also be void of any circuitry or structures to form vertical streets110 and horizontal streets 112 along which a cutting saw proceeds tosever or singulate the semiconductor substrate 104 into individualsemiconductor dice.

The rectangular adhesive prints 102 are generally formed in the mannerdiscussed above for the '679 patent illustrated in FIGS. 23-28.Referring to FIG. 24, when the adhesive material 610, such asthermoplastic adhesive materials including polyimides and thermosettingadhesive materials including phenolic resins, is applied to the stencilor screen print template 606, an adhesive material dispensing means,such as a spray nozzle, moves across the stencil or screen printtemplate 606. Thus, as shown in FIG. 2, the adhesive material dispensingmeans moves in direction 114 forming the adhesive print 102 with twolateral edges 116 parallel with direction 114, and a trailing edge 118and a leading edge 120 which are perpendicular with respect to direction114.

As shown in FIG. 3, when the stencil or screen print template (shown inFIG. 24) is removed, the adhesive prints 102 are ideally formed withvertical sidewalls 122 and a planar upper surface 124. However, aspreviously discussed, the material forming the adhesive prints 102 musthave sufficiently low viscosity to flow and fill the stencil or screenprint template as well as to allow for the removal of the stencil orscreen print template without the material forming the adhesive print102 sticking to the stencil or screen print template and thus beinglifted off the semiconductor substrate 104. Thus, the adhesive print 102will flow laterally under the force of gravity after the removal of thestencil or screen print template, as shown in FIG. 4. This flow of theadhesive print 102 can potentially cover a portion of the bond pads 108or interfere with the singulating of the semiconductor wafer by flowinginto the street areas 110, 112. This results in shortening street widthW and decreasing gravity-reduced wall angle (α_(G)), which eventuallycreates problems with dicing the wafer, inference with bond pads, anddangled leadfingers (due to loss of surface area on a leadfingerattachment surface 128 on the adhesive print 102), as previouslydiscussed.

The present invention inverts the semiconductor substrate 104 shortlyafter removal of the stencil or screen print template, as shown in FIG.5. The inversion of the semiconductor substrate 104 results ingravitational force assisting in containing the flow and expansion ofthe adhesive prints 102 during drying or curing. The inversion of thesemiconductor substrate 104 results in higher, inversion-contained wallangles (α_(I)) (also known as the “angle of repose”), wider street widthW, and a greater surface area on the leadfinger attachment surface 128.

Experimental results have demonstrated that angles of the leading edge,trailing edge and lateral edges of printed adhesives were increased andthe top surface area was also increased. FIGS. 6-8 illustrate theprofile of the lateral edges 116. FIG. 6 illustrates the scan directionacross two adjacent adhesive prints, a first adhesive print 130 and asecond adhesive print 132. The scan 134 for the profiles shown in FIGS.7 and 8 starts near lateral edge 136 of the first adhesive print 130,extends across the gap 138 between the first adhesive print 130 and thesecond adhesive print 132, and ends after a lateral edge 140 of thesecond adhesive print 132. It is noted that the z-axis (height) scalesof FIGS. 7 and 8 have been expanded in a twenty (20) to one (1) ratiofrom the x-axis (scan length) scales to better show the details of theprofiles. FIG. 7 shows a profile of the scan 134 of the first adhesiveprint 130 and the second adhesive print 132 formed by a conventionalnon-inversion method. FIG. 8 shows a profile of the scan 134 of thefirst adhesive print 130 and the second adhesive print 132 which wereformed by the inversion method of the present invention. FIGS. 7 and 8show that the lateral edge angles of repose have increased from α_(G) of18.4 degrees (lateral edge 136) and 18.0 degrees (lateral edge 140) forthe non-inversion method to α_(I) of 22 degrees (lateral edge 136) and20.6 degrees (lateral edge 140) for the inversion method of the presentinvention.

FIGS. 9-11 illustrate the profile of the trailing edge 118. FIG. 9illustrates the scan direction across the adhesive print 102. The scan142 for the profiles shown in FIGS. 10 and 11 starts prior to thetrailing edge 118 of the adhesive print 102 and ends on the leadfingerattachment surface 128 of the adhesive print 102. It is noted that thez-axis (height) scales of FIGS. 10 and 11 have been expanded in a ten(10) to one (1) ratio from the x-axis (scan length) scales to bettershow the details of the profiles. FIG. 10 shows a profile of the scan142 of the trailing edge 118 formed by a conventional non-inversionmethod. FIG. 11 shows a profile of the scan 142 of the trailing edge 118formed by the inversion method of the present invention. FIGS. 10 and 11show that the trailing edge angle of repose has increased from α_(G) of9.0 degrees for the non-inversion method to α_(G) of 13.5 degrees forthe inversion method of the present invention.

FIGS. 12-14 illustrate the profile of the leading edge 120. FIG. 12illustrates the scan direction across the adhesive print 102. The scan144 for the profiles shown FIGS. 13 and 14 starts on the leadfingerattachment surface 128 of the adhesive print 102 and ends past theleading edge 120 of the adhesive print 102. It is noted that the z-axis(height) scales of FIGS. 13 and 14 have been expanded in a ten (10) toone (1) ratio from the x-axis (scan length) scales to better show thedetails of the profiles. FIG. 13 shows a profile of the scan 144 of theleading edge 120 formed by a conventional non-inversion method. FIG. 14shows a profile of the scan 144 of the leading edge 120 formed by theinversion method of the present invention. FIGS. 13 and 14 show that theleading edge angle of repose has increased from 15.9 degrees for thenon-inversion method to 22.6 degrees for the inversion method of thepresent invention.

From these scans is was also determined that the level surface lengthwithin the adhesive print between the lateral edges 116 increased 2 to 4mils. Although the angles and definition increases from these scans arespecifically for Ablestick® XR-41395-10 with a viscosity of 40,000 cps,thixotropic index of 3.6, and a baking profile of 30 minutes at 125° C.,30 minutes at 200° C., and 30 minutes ramping from 200° C. to 245° C.,comparable results have been achieved for OxyChem® 2421-A6-sp 7495-128Bwith a viscosity of 46,000 cps, thixotropic index of 1.35, and a bakingprofile of 60 minutes at 120° C. and 180 minutes at 190° C. Thus, thegraphs shown in FIGS. 6-14 illustrate the general improvement trendwhich will be achieved through the use of the present invention.

As shown in FIGS. 15-17, adhesive coated leadfingers for LOC attachmentcan be formed by the inversion method of the present invention. Anadhesive material 202 is applied, generally by spray application, on anattachment surface 204 of a leadfinger 206, as shown in FIG. 15. Afterapplication of the adhesive material 202, the leadfinger 206 isinverted, as shown in FIG. 16. By inverting the leadfinger 206, theadhesive material 202 will not flow down the sides 208 of the leadfinger206 and, of course, will not collect on the bond wire surface 210 of theleadfinger 206, as shown in FIG. 17. Since the adhesive material 202does not collect on the bond wire surface 210, there will be no adhesivematerial 202 to interfere with the wirebonding step subsequent to LOCattachment of the active surface of the die to the leads.

FIG. 18 illustrates an encapsulated semiconductor device 302 made by theinversion method of the present invention. As discussed above andillustrated in FIGS. 33-36, a stencil 802 is placed on aconductive-carrying substrate, such as a PCB 804, such that a cavity 806in the stencil 802 exposes a semiconductor device 808 to be encapsulatedand a portion of the substrate or PCB 804 surrounding the semiconductordevice 808, as shown in FIG. 33. An encapsulant material 810, such assilicone, polyimide, urethane, acrylic, epoxy, plastic, and the like, isthen extruded from a nozzle 812 into the stencil open area 806, as shownin FIG. 34. When the stencil 802 is removed, the substrate or PCB 804 isinverted to prevent the encapsulant material 810 from spreading orflowing laterally under the force of gravity. By preventing the flow ofthe encapsulant material 810, the encapsulant material 810 on the topsurface 814 of the semiconductor device 808 remains thick enough toprovide adequate protection for the semiconductor device 808.

FIGS. 19-21 illustrate the formation of traces on a semiconductorsubstrate by the method of the present invention. A stencil or printscreen 402 with an appropriate trace design is placed over asemiconductor substrate 404, as shown in FIG. 19. A conductive material406 is applied to the stencil or print screen 402, as shown in FIG. 20.The stencil or print screen 402 is then removed leaving conductivetraces 408, and the semiconductor substrate 404 is inverted during thedrying or curing of the conductive traces 408, as shown in FIG. 21.Since the conductive material 406 is prevented from flowing laterally bythe inversion of the semiconductor substrate 404, the distance betweenparallel conductive traces 408 can be reduced, resulting in a reductionof the size of the semiconductor substrate.

FIG. 22 illustrates conductive polymer bumps 502 formed by the method ofthe present invention. As previously discussed and illustrated in FIGS.41-43, the conductive polymer bumps 1002 are generally formed on bondpads 1004 on the surface of a semiconductor substrate 1006. The bondpads 1004 are in electrical communication with integrated circuitry (notshown) on or in the semiconductor substrate 1006 via electrical traces1008 in or on the semiconductor substrate 1006. As shown in FIG. 41, aprint screen or stencil 1010 is placed over the semiconductor substrate1006 with openings 1012 over each bond pad 1004. The conductive polymer1007 is deposited in the openings 1012, as shown in FIG. 42. The printscreen or stencil 1010 is removed and the semiconductor substrate 1006inverted to maintain the definition of the conductive polymer bumps 502,as shown in FIG. 22. With the present invention, the conductive polymerbumps 502 can achieve height to width ratios of the preferred target of3:1 or greater, since the weight of the polymer material causing theconductive polymer bump 502 to collapse on itself and flow or spread isno longer an issue. It is also understood that the inversion method ofthe present invention could also be used in the formation of metallicconductive bumps.

Having thus described in detail preferred embodiments of the presentinvention, it is to be understood that the invention defined by theappended claims is not to be limited by particular details set forth inthe above description as many apparent variations thereof are possiblewithout departing from the spirit or scope thereof.

What is claimed is:
 1. A semiconductor substrate including at least onelaterally unconstrained adhesive patch comprised of a viscous adhesivematerial, the at least one adhesive patch including a first surfaceadjacent and supported from beneath by said semiconductor substrate anda second, smaller exposed surface opposite said first surface exhibitinga generally planar portion over a substantial portion thereof, saidsemiconductor substrate including said at least one adhesive patchformed by: providing a semiconductor substrate; dispensing a viscousadhesive material on said semiconductor substrate; and inverting saidsemiconductor substrate without effecting substantial lateralconfinement of said adhesive material and maintaining said semiconductorsubstrate in an inverted position at least until said viscous adhesivematerial sufficiently stabilizes so as to exhibit a desired stable shapeand a lateral boundary defining sizes of said first and second surfacesof said at least one adhesive patch and wherein at least a substantialportion of said second, smaller surface of said adhesive patch exhibitsa generally planar configuration and said size of said second, smallersurface is smaller that said size of said first surface.
 2. Thesemiconductor substrate of claim 1, wherein dispensing said viscousadhesive material, comprises: placing a template, including at least oneaperture, on said semiconductor substrate; depositing said adhesivematerial into said at least one aperture; and removing said templateprior to substantially inverting said semiconductor substrate.
 3. Aflip-chip including at least one laterally unconstrained conductive bumpcomprised of a viscous conductive material, the at least one conductivebump exhibiting a height-to-width ratio of at least approximately 3 to 1and including a first surface adjacent and supported from beneath bysaid flip-chip and a second exposed surface opposite said first surface,said flip chip including said at least one conductive bump formed by:providing said flip-chip with at least one bond pad; dispensing aviscous conductive material on said flip-chip to define at least oneconductive bump of a selected configuration exhibiting a height-to-widthratio of at least approximately 3 to 1, said at least one conductivebump in electrical communication with said at least one bond pad of saidflip-chip and including a first surface adjacent said flip-chip and asecond surface opposite said first surface; and inverting said flip-chipwithout substantial lateral confinement of said viscous conductivematerial and maintaining said flip-chip in an inverted position at leastuntil said conductive material substantially stabilizes so as to exhibita desired stable shape and lateral boundary substantially defining sizesof said first and second surfaces of said at least one conductive. 4.The flip-chip of claim 3, wherein dispensing said viscous conductivematerial includes: placing a template, including at least one aperture,on said flip-chip; depositing a conductive material into said templateaperture; and removing said template prior to inverting said flip-chip.5. The semiconductor substrate of claim 1, wherein said viscous adhesivematerial of said at least one adhesive patch comprises at least one ofthe group consisting of a polyimide, a phenolic resin, a thermoplastic,and a thermosetting plastic.
 6. The semiconductor substrate of claim 1,wherein said at least one adhesive patch comprises at least one lateraledge exhibiting an angle of repose of approximately 20 degrees.
 7. Thesemiconductor substrate of claim 1, wherein said at least one adhesivepatch comprises at least one trailing edge exhibiting an angle of reposeof approximately 13 degrees.
 8. The semiconductor substrate of claim 1,wherein said at least one adhesive patch comprises at least one leadingedge exhibiting an angle of repose of approximately 20 degrees.
 9. Thesemiconductor substrate of claim 2, wherein said template including atleast one aperture comprises a print screen including a plurality ofapertures.
 10. The semiconductor substrate of claim 2, wherein saidtemplate including at least one aperture comprises a stencil including aplurality of apertures.
 11. The flip-chip of claim 3, wherein said atleast one conductive bump comprises at least one lateral edge exhibitingan angle of repose of approximately 20 degrees.
 12. The flip-chip ofclaim 3, wherein said at least one conductive bump comprises at leastone trailing edge exhibiting an angle of repose of approximately 12degrees.
 13. The flip-chip of claim 3, wherein said at least oneconductive bump comprises at least one leading edge exhibiting an angleof repose of approximately 20 degrees.
 14. The flip-chip of claim 3,wherein said conductive material of said at least one conductive bumpcomprises a conductive polymer material.
 15. The flip-chip of claim 3,wherein said viscous conductive material of said at least one conductivebump comprises at least one of the group consisting of a polyimide, aphenolic resin, a thermoplastic, and a thermosetting plastic.
 16. Theflip-chip of claim 4, wherein said template having at least one aperturecomprises a print screen including a plurality of apertures.
 17. Theflip-chip of claim 4, wherein said template having at least one aperturecomprises a stencil including a plurality of apertures.
 18. Asemiconductor substrate including at least one laterally unconstrainedadhesive patch comprised of a viscous adhesive material exhibiting astable, self-supporting shape, the at least one adhesive patch includinga first surface adjacent and supported from beneath by saidsemiconductor substrate and a second smaller, exposed surface oppositesaid first surface, said second smaller, exposed surface exhibiting agenerally planar portion over a substantial portion thereof.
 19. Thesemiconductor substrate of claim 18, wherein said viscous adhesivematerial comprises at least one of the group consisting of a polyimide,a phenolic resin, a thermoplastic, and a thermosetting plastic.
 20. Thesemiconductor substrate of claim 18, wherein said at least one adhesivepatch comprises at least one lateral edge exhibiting an angle of reposeof approximately 20 degrees.
 21. The semiconductor substrate of claim18, wherein said at least one adhesive patch comprises at least onetrailing edge exhibiting an angle of repose of approximately 13 degrees.22. The semiconductor substrate of claim 18, wherein said at least oneadhesive patch comprises at least one leading edge exhibiting an angleof repose of approximately 20 degrees.
 23. A flip-chip including atleast one laterally unconstrained conductive bump comprised of a viscousconductive material, the at least one conductive bump exhibiting aheight-to-width ratio of at least approximately 3 to 1 and including afirst surface adjacent and supported from beneath by said flip-chip anda second exposed surface opposite said first surface.
 24. The flip-chipof claim 23, wherein said viscous conductive material of said at leastone conductive bump comprises at least one of the group consisting of apolyimide, a phenolic resin, a thermoplastic, and a thermosettingplastic.
 25. The flip-chip of claim 23, wherein said at least oneconductive bump comprises at least one lateral edge exhibiting an angleof repose of approximately 20 degrees.
 26. The flip-chip of claim 23,wherein said at least one conductive bump comprises at least onetrailing edge exhibiting an angle of repose of approximately 13 degrees.27. The flip-chip of claim 23, wherein said at least one conductive bumpcomprises at least one leading edge exhibiting an angle of repose ofapproximately 20 degrees.